Heat sink for chips

ABSTRACT

A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

The present invention relates to a heat sink for chips and two clampingmembers connect a base board to first heat dispensing units clamping thechips and the second dispensing units are fixed to the base board.

(2) Description of the Prior Art

The chips used in electronic devices such as computers generate asignificant heat during high speed operation and the heat may damage thechips and slow down the speed that the CPU operates. A conventional wayto remove heat from the chip is to provide two heat dispensing platesbetween which the chip is clamped, the heat generated from the chip isconducted to the heat dispensing plates and escapes to the air via theheat dispensing plates.

However, the latest chips generate much heat with higher temperaturethan those made by old technology so that the conventional heatdispensing plates cannot remove the heat efficiently. This is becausethe area that heat is transferred from the chip is insufficient and theconventional heat dispensing plates can only remove a certain amount ofheat because of limited heat dispensing area. Extra heat removing unitsare needed and because the limited space available in the computers sothat how to provide a high efficiency heat removing units is animportant problem.

The present invention intends to provide a heat sink for efficientlyremoving heat from the chips and includes a first heat dispensing unitclamping the chips and a second heat dispensing unit which is connectedon the first heat dispensing unit by using a base board and two clampingmembers. The heat generated from the chips is conducted to the firstheat dispensing unit and removed from the second heat dispensing units.

SUMMARY OF THE INVENTION

The present invention relates to a heat sink which comprises a firstheat dispensing unit including multiple heat dispensing plates so as toclamp chips therebetween. A base board has a contact surface defined inan underside of the base board and the contact surface is shaped todirectly match with a top of the first heat dispensing unit. A secondheat dispensing unit is fixed on a top of the base board. Two clampingmembers are connected to two ends of the base board and each of theclamping members includes a first portion and a second portion which isremovably connected to the first portion. The first portion has twoextensions extending therefrom and the second portion includes a handleand a frame which is connected to the handle. The extensions of thefirst portion are removably connected to the second portion. The tworespective frames are connected to two ends of the first heat dispensingunit.

The present invention will become more obvious from the followingdescription when taken in connection with the accompanying drawingswhich show, for purposes of illustration only, a preferred embodiment inaccordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view to show the chips and the heat sink of thepresent invention;

FIG. 2 is a perspective view to show the connection of the chips and theheat sink of the present invention;

FIG. 3 is an exploded view to show the chips and a second embodiment ofthe present invention;

FIG. 4 is a perspective view to show the connection of the chips and theheat sink in FIG. 3 of the present invention;

FIG. 5 is an exploded view to show the chips and a third embodiment ofthe heat sink of the present invention, and

FIG. 6 is a perspective view to show the connection of the chips and theheat sink in FIG. 5 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1 and 2, the heat sink 10 for removing heat fromchips 5 of the present invention comprises multiple first heatdispensing units 3, a base board 1, two second heat dispensing units 4and two clamping members 2.

The first heat dispensing units 3 each include multiple heat dispensingplates between which the chips 5 are clamped. Each heat dispensing plateof the first heat dispensing unit 3 includes protrusions 31 extendingfrom two ends thereof. The base board 1 has a contact surface 11 definedin an underside of the base board 1 and the contact surface 11 is shapedto match with the top of the first heating dispensing units 3. Two holes12 are defined through the base board 1 and a plurality of threadedholes 13 are located around the holes 12. The contact surface 11 is incontact with the top of the first heat dispensing unit 3 and two firstconnection holes 14 are defined through two ends of the base board 1.The second heat dispensing units 4 are fixed on a top of the base board1 by extending bolts through passages 41 in the second heat dispensingunits 4 and connected to the threaded holes 13 in the base board 1. Thesecond heat dispensing units 4 are located corresponding to the holes12. The two clamping members 2 connect the base board 1 to the firstheat dispensing units 3.

The two clamping members 2 each include a first portion 21 and a secondportion 22 which is removably connected to the first portion 21. Thefirst portion 21 of each of the clamping members 2 includes a plate 211which is fixed on each of the two ends of the base hoard 1 by extendingbolts through holes 213 defined through the plate 211 and connected toconnection holes 14 in the base board 1. Two extensions 212 extend fromthe plate 211 and two L-shaped insertions 214 extend from the twoextensions 212 respectively. Each insertion 214 includes a hook part215.

The second portion 22 of each of the clamping members 2 includes ahandle 221 and a frame 222 which is connected to the handle 221 by aneck portion. A slot 223 is defined through the neck portion. The twoinsertions 214 can be inserted through the slot 223 and the hook parts215 are engaged with a rear side of the neck portion. The two respectiveframes 222 are connected to the protrusions 31 on each end of the firstheat dispensing unit 3.

The base board 1 includes two holes 12 defined therethrough and thesecond heat dispensing units 4 are located corresponding to the holes12. Therefore, the heat generated from the chips 5 is conducted to thefirst heat dispensing unit 3 and sucked out by the second heatdispensing units 4. In this embodiment, the second heat dispensing units4 are two fans.

FIGS. 3 and 4 show the second embodiment of the heat sink 10 of thepresent invention, wherein the base board 1 does not have the holes 12as shown in FIG. 1 and the second heat dispensing unit 4 is awater-cooling unit.

As shown in FIG. 5, the third embodiment of the heat sink 10 of thepresent invention is disclosed, wherein the second heat dispensing unit4 is an aluminum extruding member which include the base board 1 on theunderside of the aluminum extruding member. The aluminum extrudingmember includes multiple fins extending therefrom so as to increase areathat releases the heat.

While we have shown and described the embodiment in accordance with thepresent invention, it should be clear to those skilled in the art thatfurther embodiments may be made without departing from the scope of thepresent invention.

1. A heat sink comprising: a first heat dispensing unit includingmultiple heat dispensing plates which are adapted to clamp chipstherebetween; a base board having a contact surface defined in anunderside of the base board, the contact surface being shaped todirectly match with a top of the first heat dispensing unit, a secondheat dispensing unit fixed on a top of the base board, and two clampingmembers connected to two ends of the base board and each of the clampingmembers including a first portion and a second portion which isremovably connected to the first portion, the first portion having twoextensions extending therefrom and the second portion including a handleand a frame which is connected to the handle, the extensions of thefirst portion removably connected to the second portion, the tworespective frames connected to two ends of the first heat dispensingunit.
 2. The heat sink as claimed in claim 1, wherein each heatdispensing plate of the first heat dispensing unit includes protrusionson two ends thereof, the respective frames of the clamping members arehooked to the protrusions.
 3. The heat sink as claimed in claim 1,wherein the base board includes a hole defined therethrough and thesecond heat dispensing unit is located corresponding to the hole.
 4. Theheat sink as claimed in claim 1, wherein the first portion of each ofthe clamping members includes a plate which is fixed on the base hoardand the two extensions extend from the plate, two L-shaped insertionsextend from the two extensions respectively and each insertion includesa hook part, the handle of each of the clamping members is connected tothe frame by a neck portion through which a slot is defined, the twoinsertions are inserted through the slot and the hook parts are engagedwith a rear side of the neck portion.
 5. The heat sink as claimed inclaim 1, the second heat dispensing unit is a fan.
 6. The heat sink asclaimed in claim 1, the second heat dispensing units is a water-coolingunit.
 7. The heat sink as claimed in claim 1, the second heat dispensingunit is an aluminum extruding member.
 8. The heat sink as claimed inclaim 7, wherein the aluminum extruding member includes multiple finsformed thereto.